Trend Blogs

Beyond the three major memory suppliers, HBM growth is creating a second layer of beneficiaries in bonding, inspection, process equipment, materials, thermal management and advanced packaging...

Solid-state transformers are advancing toward 800 VDC AI infrastructure. Recent evidence shows why protection, reliability and commissioning will determine commercial readiness...

Micro-emitter optical interconnects promise efficient AI links. Standards, connector qualification and measured system economics will determine deployment readiness...

Automotive safety MEMS integration shifts the decision toward diagnostics, calibration and verifiable controller responses. What buyers should qualify next...

Co-packaged optics now faces a manufacturing test: automated fiber attachment, known-good engines, laser serviceability and repeatable yield economics...

Laser-threshold diamond magnetometry improves optical readout. The next test is measured noise, stable integration and repeatable application performance...

MEMS ultrasound needs more than a smaller chip. Examine acoustic interfaces, protective losses and the evidence required for dependable sensor integration...

Edge AI sensing needs a whole-system energy budget. See what a recent experiment establishes, where sleep power matters, and how to qualify a sensor design...

Optical conversion is moving closer to AI processors, shifting value toward photonic engines, lasers, fiber connectivity, packaging and test...

Atomic pitch splitting enters pilot-line evaluation. Process integration, wafer-scale repeatability and tool acceptance will determine its manufacturing value...